Key Applications High Performance Computing AI/Deep Learning Training and Inference Large Language Model (LLM) and Generative AI Key Features This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Supermicro Salesperson for details. Two nodes in a 1U form factor. Each node supports the following: High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU (1 per Node) NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU) NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control This system supports two E1.S drives directly from the processor only.

Key Applications

High Performance Computing

AI/Deep Learning Training and Inference

Large Language Model (LLM) and Generative AI

Key Features

This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Supermicro Salesperson for details.

Two nodes in a 1U form factor. Each node supports the following:

High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU (1 per Node)

NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)

NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s

Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications

2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7

7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control

This system supports two E1.S drives directly from the processor only.

Product SKUs

ARS-111GL-DNHR-LCC

Motherboard

Super G1SMH-G

Processor (per Node)

CPU

NVIDIA 72-core NVIDIA Grace CPU on GH200 Grace Hopper™ Superchip

Note

Supports up to 2000W TDP CPUs (Liquid Cooled)​

GPU (per Node)

Max GPU Count

Up to 1 onboard GPU(s)

Supported GPU

NVIDIA: H100 Tensor Core GPU on GH200 Grace Hopper™ Superchip (Liquid-cooled)

View GPU Options

CPU-GPU Interconnect

NVLink®-C2C

GPU-GPU Interconnect

PCIe

System Memory (per Node)

Memory

Slot Count: Onboard Memory

Max Memory: Up to 480GB ECC LPDDR5X

Additional GPU Memory: Up to 96GB ECC HBM3

On-Board Devices (per Node)

Chipset

System on Chip

Network Connectivity

View AOC Options

Input / Output (per Node)

LAN

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

USB

2 port(s) (rear)

Video

1 mini-DP port(s)

System BIOS

BIOS Type

AMI 64MB SPI Flash EEPROM

Management

Power configurations

Power-on mode for AC power recovery

ACPI Power Management

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

1U Rackmount

Model

CSE-GP102TS-R000NDFP

Dimensions and Weight

Height

1.75″ (44 mm)

Width

17.33″ (440 mm)

Depth

37″ (940 mm)

Package

9.5″ (H) x 48″ (W) x 28″ (D)

Weight

Gross Weight: 65.5 lbs (29.7 kg)

Net Weight: 48.5 lbs (22 kg)

Available Color

Silver

Expansion Slots (per Node)

PCI-Express (PCIe) Configuration

Default

2 PCIe 5.0 x16 FHFL slot(s)

View AOC Options

Drive Bays / Storage (per Node)

Drive Bays Configuration

Default: Total 4 bay(s)

4 front hot-swap E1.S NVMe drive bay(s)

M.2

2 M.2 NVMe slot(s) (M-key)

System Cooling

Fans

7 Removable heavy-duty 4cm Fan(s)

Liquid Cooling

Direct to Chip (D2C) Cold Plate (optional)

Power Supply

2x 2700W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL)

73.5 x 40 x 185 mm

AC Input

2700W: 200-240Vac / 50-60Hz

2700W: 240-240Vdc / 50-60Hz (for CQC only)

+12V

Max: 225A / Min: 0A (200Vac-240Vac)

Max: 225A / Min: 0A (240Vdc-240Vdc)

12V SB

Max: 4A / Min: 0A

Output Type

Backplanes (gold finger)

Operating Environment

Environmental Spec.

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)

Operating Relative Humidity: 8% to 90% (non-condensing)

Non-operating Relative Humidity: 5% to 95% (non-condensing)