Key Applications High Performance Computing AI/Deep Learning Training Industrial Automation, Retail Healthcare Conversational AI Business Intelligence & Analytics Drug Discovery Climate and Weather Modeling Finance & Economics Key Features 5th/4th Gen Intel® Xeon® Scalable processor support 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5 8 PCIe Gen 5.0 X16 LP 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional) Flexible networking options 2 M.2 NVMe for boot drive only 16x 2.5" Hot-swap NVMe drive bays (12x by default, 4x optional) 3x 2.5" Hot-swap SATA drive bays Optional: 8x 2.5" Hot-swap SATA drive bays 10 heavy duty fans with optimal fan speed control Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level 6x 3000W (4+2) Redundant Power Supplies, Titanium Level

Key Applications

High Performance Computing

AI/Deep Learning Training

Industrial Automation, Retail

Healthcare

Conversational AI

Business Intelligence & Analytics

Drug Discovery

Climate and Weather Modeling

Finance & Economics

Key Features

5th/4th Gen Intel®  Xeon® Scalable processor support

32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5

8 PCIe Gen 5.0 X16 LP

2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional)

Flexible networking options

2 M.2 NVMe for boot drive only

16x 2.5″ Hot-swap  NVMe drive bays (12x by default, 4x optional)

3x 2.5″ Hot-swap  SATA drive bays

Optional: 8x 2.5″ Hot-swap  SATA drive bays

10 heavy duty fans with optimal fan speed control

Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level

6x 3000W (4+2) Redundant Power Supplies, Titanium Level

Product SKUs

SuperServer SYS-821GE-TNHR

Motherboard

Super X13DEG-OAD

Processor

CPU

Dual Socket E (LGA-4677)

5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Core Count

Up to 64C/128T; Up to 320MB Cache per CPU

Note

Supports up to 350W TDP CPUs (Air Cooled)

Supports up to 385W TDP CPUs (Liquid Cooled)​

GPU

Max GPU Count

Up to 8 onboard GPU(s)

Supported GPU

NVIDIA SXM: HGX H100 8-GPU (80GB)

View GPU Options

CPU-GPU Interconnect

PCIe 5.0 x16 CPU-to-GPU Interconnect

GPU-GPU Interconnect

NVIDIA® NVLink® with NVSwitch™

Certification

System Memory

Memory

Slot Count: 32 DIMM slots

Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM

Max Memory (2DPC): Up to 8TB 4400MT/s ECC DDR5 RDIMM

View Memory Options

Memory Voltage

1.1V

On-Board Devices

Chipset

Intel® C741

Network Connectivity

2 RJ45 10GbE with Intel® X550-AT2 (optional)

2 SFP28 25GbE with Broadcom® BCM57414 (optional)

2 RJ45 10GbE with Intel® X710-AT2 (optional)

View AOC Options

Input / Output

Video

1 VGA port(s)

System BIOS

BIOS Type

AMI 32MB SPI Flash EEPROM

Management

Software

SuperCloud Composer

Supermicro Server Manager (SSM)

Supermicro Update Manager (SUM)

Supermicro SuperDoctor® 5 (SD5)

Super Diagnostics Offline (SDO)

Supermicro Thin-Agent Service (TAS)

SuperServer Automation Assistant (SAA) New!

Power configurations

Power-on mode for AC power recovery

ACPI Power Management

Security

Hardware

Trusted Platform Module (TPM) 2.0

Silicon Root of Trust (RoT) – NIST 800-193 Compliant

Features

Cryptographically Signed Firmware

Secure Boot

Secure Firmware Updates

Automatic Firmware Recovery

Supply Chain Security: Remote Attestation

Runtime BMC Protections

System Lockdown

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory

8+4 Phase-switching voltage regulator

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

8U Rackmount

Model

CSE-GP801TS

Dimensions and Weight

Height

14″ (355.6 mm)

Width

17.2″ (437 mm)

Depth

33.2″ (843.28 mm)

Package

29.5″ (H) x 27.5″ (W) x 51.2″ (D)

Weight

Gross Weight: 225 lbs (102.1 kg)

Net Weight: 166 lbs (75.3 kg)

Available Color

Black front & silver body

Front Panel

LED

Hard drive activity LED

Network activity LEDs

Power status LED

System Overheat & Power Fail LED

Buttons

Power On/Off button

System Reset button

Expansion Slots

PCI-Express (PCIe) Configuration

Default

8 PCIe 5.0 x16 LP slot(s)

2 PCIe 5.0 x16 FHHL slot(s)

View AOC Options

Drive Bays / Storage

Drive Bays Configuration

Default: Total 15 bay(s)

12 front hot-swap 2.5″ NVMe drive bay(s)

3 front hot-swap 2.5″ SATA drive bay(s)

Option A: Total 19 bay(s)

12 front hot-swap 2.5″ NVMe drive bay(s)

4 front hot-swap 2.5″ NVMe* drive bay(s)

3 front hot-swap 2.5″ SATA drive bay(s)

(*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)

View Drive Options

M.2

2 M.2 NVMe slot(s) (M-key)

View M.2 Options

System Cooling

Fans

10 heavy duty fans with optimal fan speed control

Liquid Cooling

Direct to Chip (D2C) Cold Plate (optional)

Power Supply

6x 3000W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL)

106.5 x 82.1 x 245.5 mm

AC Input

3000W: 0240Vdc / 50-60Hz (for CQC only)

2880W: 200-207Vac / 50-60Hz

3000W: 207-240Vac / 50-60Hz

+12V

Max: 91.66A / Min: 0A (200Vac-240Vac)

12V SB

Max: 3A / Min: 0A

Output Type

Backplanes (gold finger)

Operating Environment

Environmental Spec.

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)

Operating Relative Humidity: 8% to 90% (non-condensing)

Non-operating Relative Humidity: 5% to 95% (non-condensing)