واحة دبي للسيليكون, Dubai
Brand
SupermicroQuantity
Key Applications Virtualization Software-defined Storage AI Inference and Machine Learning Cloud Computing Enterprise Server Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series Optional PCIe slot configurations up to 8 PCIe 4.0 x8 or 4 PCIe 4.0 x16 slots with support for double-width GPU/Accelerator cards Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible) 24x 2.5" hot-swap NVMe/SATA/SAS drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card 4 heavy duty hot-swap fans with optimal fan speed control
Key Applications
Virtualization
Software-defined Storage
AI Inference and Machine Learning
Cloud Computing
Enterprise Server
Key Features
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
Optional PCIe slot configurations up to 8 PCIe 4.0 x8 or 4 PCIe 4.0 x16 slots with support for double-width GPU/Accelerator cards
Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
24x 2.5″ hot-swap NVMe/SATA/SAS drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card
4 heavy duty hot-swap fans with optimal fan speed control
Product SKUs
SuperServer SYS-220H-TN24R
Motherboard
Super X12DHM-6
Processor
CPU
Dual Socket P+ (LGA-4189)
3rd Gen Intel® Xeon® Scalable processors
Core Count
Up to 40C/80T; Up to 60MB Cache per CPU
Note
Supports up to 270W TDP CPUs (Air Cooled)
GPU
Max GPU Count
Up to 4 double-width GPU(s)
System Memory
Memory
Slot Count: 32 DIMM slots
Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4
Supports Intel® Optane™ persistent memory 200 series
View Memory Options
Memory Voltage
1.2V
On-Board Devices
SATA
SATA (6Gbps) ; RAID 0/1/5/10 support
NVMe
NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)
View NVMe Options
Chipset
Intel® C621A
Network Connectivity
2 RJ45 1GbE with Intel® I350-AM2 (optional)
4 RJ45 1GbE with Intel® I350-AM4 (optional)
4 SFP 1GbE with Intel® I350-AM4 (optional)
2 RJ45 10GBASE-T with Intel® X550-AT2 (optional)
2 SFP+ 10GbE with Intel® X710-BM2 (optional)
4 SFP+ 10GbE with Intel® XL710-BM1 (optional)
4 SFP+ 10GbE with Intel® X710-TM4 (optional)
2 SFP28 25GbE with Broadcom® BCM57414 (optional)
4 SFP28 25GbE (optional)
2 QSFP28 100GbE with Broadcom® BCM57508 (optional)
View AIOM Options
View AOC Options
Input / Output
LAN
1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB
2 USB 3.0 port(s) (rear)
Video
1 VGA port(s)
System BIOS
BIOS Type
AMI 256MB SPI Flash
Management
Software
SuperCloud Composer
Supermicro Server Manager (SSM)
Supermicro Update Manager (SUM)
Supermicro SuperDoctor® 5 (SD5)
Super Diagnostics Offline (SDO)
Supermicro Thin-Agent Service (TAS)
SuperServer Automation Assistant (SAA) New!
Power configurations
Power-on mode for AC power recovery
ACPI Power Management
Security
Hardware
Trusted Platform Module (TPM) 2.0
Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
Cryptographically Signed Firmware
Secure Boot
Secure Firmware Updates
Automatic Firmware Recovery
System Lockdown
PC Health Monitoring
CPU
Monitors for CPU Cores, Chipset Voltages, Memory
FAN
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor
2U Rackmount
Model
CSE-HS219-R1K63P
Dimensions and Weight
Height
3.5″ (88.9 mm)
Width
17.2″ (437 mm)
Depth
29.9″ (760 mm)
Package
10.4″ (H) x 23.8″ (W) x 43.6″ (D)
Weight
Gross Weight: 66 lbs (30 kg)
Net Weight: 40 lbs (18.2 kg)
Available Color
N/A
Front Panel
LED
HDD activity
LAN1 activity
Power
System information
Buttons
Power On/Off
UID button
Expansion Slots
PCI-Express (PCIe) Configuration
Default*
8 PCIe 4.0 x8 (in x16) FH/10.5″L slot(s)
2 PCIe 4.0 x16 AIOM slot(s) (OCP 3.0 compatible)
Option A*
2 PCIe 4.0 x8 (in x16) FH/10.5″L slot(s)
3 PCIe 4.0 x16 FH/10.5″L slot(s)
2 PCIe 4.0 x16 AIOM slot(s) (OCP 3.0 compatible)
(*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)
View AOC Options
Drive Bays / Storage
Drive Bays Configuration
Default: Total 24 bay(s)
24 front hot-swap 2.5″ NVMe*/SAS*/SATA* drive bay(s)
(*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)
View Drive Options
M.2
2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)
View M.2 Options
System Cooling
Fans
4x 8cm heavy duty fans with optimal fan speed control
Air Shroud
2 Air Shroud(s)
Power Supply
2x 1600W Redundant Titanium Level (96%) Hot-plug power supplies
Dimension (WxHxL)
73.5 x 40 x 265 mm
AC Input
1000W: 100-127Vac / 50-60Hz
1600W: 200-240Vac / 50-60Hz
1600W: 200-240Vdc / 50-60Hz (for CQC only)
+12V
Max: 83.3A / Min: 0A (100Vac-127Vac)
Max: 133.3A / Min: 0A (200Vac-240Vac)
12V SB
Max: 3.5A
Output Type
Backplanes (gold finger)
Operating Environment
Environmental Spec.
Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)