Key Applications 5G Core and Edge Telecom Micro Data Center AI Inference and Machine Learning Network Function Virtualization Cloud Computing Key Features Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series 3 PCIe 4.0 x16 slots with GPU/Accelerator support (Default); 1 PCIe 4.0 x16 expansion slots (Optional) Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible) Up to 6x 2.5" hot-swap drive bays with options to support NVMe/SATA drives 6 heavy duty hot-swap fans with optimal fan speed control Front I/O, tool-less design Redundant 2000W redundant AC power supplies

Key Applications

5G Core and Edge

Telecom Micro Data Center

AI Inference and Machine Learning

Network Function Virtualization

Cloud Computing

Key Features

Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors

32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series

3 PCIe 4.0 x16 slots with GPU/Accelerator support (Default);

1 PCIe 4.0 x16 expansion slots (Optional)

Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible)

Up to 6x 2.5″ hot-swap drive bays with options to support NVMe/SATA drives

6 heavy duty hot-swap fans with optimal fan speed control Front I/O, tool-less design

Redundant 2000W redundant AC power supplies

Product SKUs

SuperServer SYS-220HE-FTNR

Motherboard

Super X12DHM-6

Processor

CPU

Dual Socket P+ (LGA-4189)

3rd Gen Intel® Xeon® Scalable processors

Note

Supports up to 270W TDP CPUs (Air Cooled)

GPU

Max GPU Count

Up to 3 double-width or 3 single-width GPU(s)

Supported GPU

NVIDIA PCIe: T4, A40, A100, A10

View GPU Options

CPU-GPU Interconnect

PCIe 4.0 x16 CPU-to-GPU Interconnect

System Memory

Memory

Slot Count: 32 DIMM slots

Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM

View Memory Options

Memory Voltage

1.2V

On-Board Devices

SATA

SATA (6Gbps) ; RAID 0/1/5/10 support

NVMe

NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)

View NVMe Options

Chipset

Intel® C621A

Network Connectivity

2 RJ45 1GbE with Intel® I350-AM2 (optional)

4 SFP 1GbE with Intel® I350-AM4 (optional)

2 RJ45 10GBASE-T with Intel® X550-AT2 (optional)

2 SFP+ 10GbE with Intel® X710-BM2 (optional)

4 SFP+ 10GbE with Intel® XL710-BM1 (optional)

4 SFP+ 10GbE with Intel® X710-TM4 (optional)

2 SFP28 25GbE with Broadcom® BCM57414 (optional)

4 SFP28 25GbE (optional)

2 QSFP28 100GbE with Broadcom® BCM57508 (optional)

4 RJ45 1GbE with Intel® I350-AM4 (optional)

View AIOM Options

View AOC Options

Input / Output

LAN

1 RJ45 1 GbE Dedicated BMC LAN port(s)

USB

2 USB 2.0 port(s) (front)

Video

1 VGA port(s)

Management

Software

SuperCloud Composer

Supermicro Server Manager (SSM)

Supermicro Update Manager (SUM)

Supermicro SuperDoctor® 5 (SD5)

Super Diagnostics Offline (SDO)

Supermicro Thin-Agent Service (TAS)

SuperServer Automation Assistant (SAA) New!

Power configurations

Power-on mode for AC power recovery

ACPI Power Management

Security

Hardware

Trusted Platform Module (TPM) 2.0

Silicon Root of Trust (RoT) – NIST 800-193 Compliant

Features

Cryptographically Signed Firmware

Secure Boot

Secure Firmware Updates

Automatic Firmware Recovery

System Lockdown

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

2U Rackmount

Model

CSE-HE211-R000NFP

Dimensions and Weight

Height

3.5″ (88.9 mm)

Width

17.2″ (436.88 mm)

Depth

22.6″ (574 mm)

Package

9.7″ (H) x 23.5″ (W) x 36.9″ (D)

Weight

Gross Weight: 47.4 lbs (21.5 kg)

Net Weight: 34.4 lbs (15.6 kg)

Available Color

Silver

Front Panel

LED

HDD activity LED

LAN1 activity

LAN2 activity

Power Fail

Power status LED

System information

Buttons

Power On/Off

UID button

Expansion Slots

PCI-Express (PCIe) Configuration

Default

3 PCIe 4.0 x16 FHFL slot(s)

1 PCIe 4.0 x16 FHHL slot(s)

Option A

6 PCIe 4.0 x8 (in x16) FHFL slot(s)

2 PCIe 4.0 x8 (in x16) FHHL slot(s)

View AOC Options

Drive Bays / Storage

Drive Bays Configuration

Default: Total 6 bay(s)

6 front hot-swap 2.5″ NVMe/SAS/SATA drive bay(s)

View NVMe Options

View Drive Options

M.2

2 M.2 NVMe/SATA slot(s) (M-key 2280/22110)

View M.2 Options

System Cooling

Fans

6 Counter-rotating, Hot-swappable 60x60x56mm Fan(s)

Power Supply

1x 2000W Redundant Titanium (certification pending) Level (96%) power supply

Dimension (WxHxL)

73.5 x 40 x 203 mm

AC Input

1000W: 100-127Vac / 50-60Hz

1800W: 200-220Vac / 50-60Hz

1980W: 220-230Vac / 50-60Hz

2000W: 220-240Vac / 50-60Hz (for UL only)

2000W: 230-240Vac / 50-60Hz

2000W: 230-240Vdc / 50-60Hz (for China only)

+12V

Max: 83A (100Vac-127Vac)

Max: 150A (200Vac-220Vac)

Max: 165A (220Vac-230Vac)

Max: 166A (230Vac-240Vac)

12V SB

Max: 3.5A

Output Type

Backplanes (gold finger)

Operating Environment

Environmental Spec.

Operating Temperature: 5°C ~ 35°C (41°F ~ 95°F)

Non-operating Temperature: -40°C to 70°C (-40°F to 158°F)

Operating Relative Humidity: 8% to 90% (non-condensing)

Non-operating Relative Humidity: 5% to 95% (non-condensing)