Key Features Compute Intensive Applications Data Center, HPC and Enterprise Applications Hyperscale, Hyperconverged RoT (Root of Trust) support to protect firmware security 4U 8 node system, each node: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (for SIOM ) 4. 2 or 4 Fixed 2.5" SATA3/NVMe drive bays, M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 and 1 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port (front) 6. 1 VGA, 2 USB 3.0 ports (front) 7. 8x 8cm 13.5k RPM rear fans per enclosure 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

Key Features

Compute Intensive Applications

Data Center, HPC and Enterprise

Applications

Hyperscale, Hyperconverged

RoT (Root of Trust) support

to protect firmware security

4U 8 node system, each node:

1. Dual Socket P (LGA 3647) support

2nd Gen Intel® Xeon® Scalable

processors (Cascade Lake/Skylake)‡

2. 12 DIMMs; up to 3TB 3DS ECC

DDR4-2933MHz† RDIMM/LRDIMM,

Supports Intel® Optane™ DCPMM††

3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

(LP), 1 PCI-E 3.0 x16 (for SIOM )

4. 2 or 4 Fixed 2.5″ SATA3/NVMe drive

bays, M.2 Interface: 2 SATA/PCI-E

3.0 x4, RAID 0 and 1

M.2 Form Factor: 2260, 2280, 22110

M.2 Key: M-Key

5. Dual GbE ports via SIOM Network

card, 1 dedicated IPMI LAN port

(front)

6. 1 VGA, 2 USB 3.0 ports (front)

7. 8x 8cm 13.5k RPM rear fans

per enclosure

8. 2200W Redundant Power Supplies

Titanium Level (96% Efficiency)

Product SKUs

SYS-F619P2-FT+

SuperServer F619P2-FT+ (Black)

Motherboard

Super X11DPFF-SN

Processor (per Node)

CPU

Dual Socket P (LGA 3647)

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,

Dual UPI up to 10.4GT/s

Support CPU TDP 70-165W with IVR

Cores

Up to 28 Cores

Note

‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)

System Memory (per Node)

Memory Capacity

12 DIMM slots

Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM

Supports Intel® Optane™ DCPMM††

Memory Type

2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM

Note

† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro

†† Cascade Lake only. Contact your Supermicro sales rep for more info.

On-Board Devices

Chipset

Intel® C621 chipset

SATA

SATA3 (6Gbps); RAID 0, 1, 5, 10

Network Controllers

Flexible networking via SIOM

IPMI

Support for Intelligent Platform Management Interface v.2.0

IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Graphics

ASPEED AST2500 BMC

Input / Output (per node)

LAN

SIOM flexible Network card

1 RJ45 Dedicated IPMI LAN port (front)

USB

2 USB 3.0 ports (front)

VGA

1 VGA port (front)

System BIOS

BIOS Type

128Mb SPI Flash EEPROM with AMI BIOS

Management

Software

Intel® Node Manager

IPMI 2.0

KVM with dedicated LAN

SuperDoctor® 5

Watch Dog

Power Configurations

ACPI Power Management

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory.

4+1 Phase-switching voltage regulator

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

4U Rackmount

Model

CSE-F418IF3-R2K20BP

Dimensions and Weight

Width

17.63″ (448mm)

Height

6.96″ (177mm)

Depth

29″ (737mm)

Package

28.3″ (W) x 15.0″ (H) x 42.4″ (D)

Weight

Net Weight: 150 lbs (68.04 kg)

Gross Weight: 200 lbs (90.71 kg)

Available Colors

Black

Front Panel

Buttons

Power On/Off button

UID button

LEDs

Power status LED

Network activity LEDs

Information LED (Fan failure, Overheat)

Expansion Slots (per node)

PCI-Express

1 PCI-E 3.0 x16 (Low-profile)

1 PCI-E 3.0 x8 (Low-profile)

1 PCI-E 3.0 x16 (SIOM)

Drive Bays (per node)

Fixed

2 or 4 Fixed 2.5″ SATA3/NVMe drive bays

M.2

M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1

M.2 Form Factor: 2260, 2280, 22110

M.2 Key: M-Key

System Cooling

Fans

8x 8cm 13.5k RPM rear fans per enclosure

Power Supply

2200W Redundant Power Supplies with PMBus

Total Output Power and Input

1200W with Input 100-127Vac

1800W with Input 200-220Vac

1980W with Input 220-230Vac

2090W with Input 230-240Vac

2200W with Input 220-240Vac (for UL/cUL use only)

2090W with Input 230-240Vdc (for CCC only)

AC Input Frequency

50-60Hz

Dimension

(W x H x L)

76 x 40 x 336 mm

+12V

Max: 100A / Min: 0A (100-127Vac)

Max: 150A / Min: 0A (200-220Vac)

Max: 165A / Min: 0A (220-230Vac)

Max: 174.17A / Min: 0A (230-240Vac)

Max: 183.3A / Min: 0A (220-240Vac)

5VSB

Max: 1A / Min: 0A

Output Type

Backplanes (gold finger)

Certification

Titanium Level

[ Test Report ]

Operating Environment

RoHS

RoHS Compliant

Environmental Spec.

Operating Temperature:

10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature:

-40°C to 60°C (-40°F to 140°F)

Operating Relative Humidity:

8% to 90% (non-condensing)

Non-operating Relative Humidity:

5% to 95% (non-condensing)