Key Applications - AI/ML, Deep Learning Training and Inference - High-performance Computing (HPC) - Cloud Computing - Research Laboratory/National Laboratory - Autonomous Vehicle Technologies - Molecular Dynamics Simulation Key Features 1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.2x 2200W Platinum Level power supplies with Smart Power Redundancy

Key Applications

– AI/ML, Deep Learning Training and Inference

– High-performance Computing (HPC)

– Cloud Computing

– Research Laboratory/National Laboratory

– Autonomous Vehicle Technologies

– Molecular Dynamics Simulation

Key Features

1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)

2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)

3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect

4.On board BMC supports integrated

IPMI 2.0 + KVM with dedicated 10G LAN

5.Dual AMD EPYC™ 7003/7002 Series Processors

(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)

6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs

7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)

8.4 Hot-swap 2.5″ drive bays

(SAS/SATA/NVMe Hybrid)

9.2x 2200W Platinum Level power supplies with Smart Power Redundancy

Product SKUs

AS -2124GQ-NART

A+ Server 2124GQ-NART (Black)

Motherboard

Super H12DSG-Q-CPU6

Processor/Cache

CPU

Dual AMD EPYC™ 7003/7002 Series Processors

(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)

Socket SP3

Supports CPU TDP up to 280W*

Cores

Up to 128 Cores (64 per CPU)

Note

* Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization

GPU Support

Supports HGX A100 4-GPU 40GB (HBM2) or 80GB(HBM2e) with NVLink GPU interconnect and PCI-E Gen4 host CPUs

GPU

Supported GPUs

HGX A100 4-GPU 40GB/80GB SXM4 Multi-GPU Board

CPU-GPU Interconnect

PCI-E Gen 4 x16 Direct Connect CPU-GPU Dual-Root

GPU-GPU Interconnect

NVIDIA® NVLink™ GPU-to-GPU Interconnect

System Memory

Memory Capacity

32 DIMM slots

Up to 8TB 3DS ECC DDR4-3200MH SDRAM

Memory Type

3200MHz ECC DDR4 SDRAM

On-Board Devices

Chipset

System on Chip (SoC)

Network

Dual RJ45 10GbE-aggregate host LAN, RJ45 1GbE IPMI

IPMI

Support for Intelligent Platform Management Interface v.2.0

IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Graphics & System Management

ASPEED AST2600 BMC

Input / Output

SATA

4 SATA3 (6Gbps) ports

LAN

2 RJ45 10GbE-aggregate host LAN ports

1 RJ45 1GbE Dedicated IPMI management port

USB

2 USB 3.0 ports (rear)

Video

1 VGA Connector (rear)

Others

1 COM port (header)

1 TPM 2.0 (header)

System BIOS

BIOS Type

AMI 256Mb SPI Flash ROM

Management

Software

IPMI 2.0

KVM with dedicated LAN

SSM, SPM, SUM

SuperDoctor® 5

Watchdog

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory.

4+1 Phase-switching voltage regulator

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

2U Rackmountable

Model

CSE-228GTS-R2K21P

Dimensions

Height

3.5″ (89mm)

Width

17.2″ (437mm)

Depth

~32.7″ (830.3mm)

Weight

Net Weight: 78.5 lbs (35.6 kg)

Gross Weight: 88.5 lbs (40.1 kg)

Package Dimensions

45.5″ L x 22.5″ W x 11″ H

Available Colors

Black

Drive Bays / Storage

Hot-swap

4 Hot-swap 2.5″ drive bays (SATA/NVMe Hybrid or SAS with optional HBA)

Expansion Slots

PCI-Express

4 PCI-E Gen4 x16 (LP) slots – supporting HGX A100 4-GPU’s 1:1 connection to 4 NICs

1 PCI-E Gen 4 x8 (LP) slot

System Cooling

Fans

4 Hot-swap heavy duty fans

Power Supply

2200W Redundant Power Supplies with PMBus

Total Output Power

1000W: 100 – 127Vac

2200W: 220 – 240Vac

Dimension

(W x H x L)

107 x 82 x 204 mm

Input

100-127Vac / 12-9.5A / 50-60Hz

220-240Vac / 11-10A / 50-60Hz

Output Type

Gold Finger Connector

Certification

Platinum Level

Operating Environment

RoHS

RoHS Compliant

Environmental Spec.

Operating Temperature:

10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature:

-40°C to 60°C (-40°F to 140°F)

Operating Relative Humidity:

8% to 90% (non-condensing)

Non-operating Relative Humidity:

5% to 95% (non-condensing)