Key Applications Container-as-a-Service; Application Accelerator Diskless HPC Clusters All-Flash Hyperconverged Infrastructure Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors Intel® C741 16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600 2 PCIe 5.0 x16 (LP) slot; Tool-less support Internal PCIe 4.0 for 2 x4 M.2 NVMe support onboard Optional M.2 (22x80) HW RAID1 NVMe Boot Controller via SCC-A2NM2241G3-B1 Network connectivity via AIOM (OCP 3.0 compliant) Built-in SAS3 Support via Broadcom 3808; IT Mode 6 hot-swap 2.5" drive bays (2x PCIe 5.0 NVMe/SAS and 4x PCIe 4.0 NVMe/SAS) Liquid Cooling Support 4 cooling fans per 2U enclosure, 16K RPM; Shared Cooling Design, Counter-Rotating 3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

Key Applications

Container-as-a-Service; Application Accelerator

Diskless HPC Clusters

All-Flash Hyperconverged Infrastructure

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors

Intel® C741

16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600

2 PCIe 5.0 x16 (LP) slot;

Tool-less support

Internal PCIe 4.0 for 2 x4 M.2 NVMe support onboard

Optional M.2 (22×80) HW RAID1 NVMe Boot Controller via SCC-A2NM2241G3-B1

Network connectivity via AIOM (OCP 3.0 compliant)

Built-in SAS3 Support via Broadcom 3808; IT Mode

6 hot-swap 2.5″ drive bays (2x PCIe 5.0 NVMe/SAS and 4x PCIe 4.0 NVMe/SAS)

Liquid Cooling Support

4 cooling fans per 2U enclosure, 16K RPM; Shared Cooling Design, Counter-Rotating

3000W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

Product SKUs

SuperServer SYS-221BT-HNC8R

Motherboard

Super X13DET-B

Processor (per Node)

CPU

Dual Socket E (LGA-4677)

5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors

Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)​

Core Count

Up to 64C/128T; Up to 320MB Cache per CPU

Note

Supports up to 205W TDP CPUs (Air Cooled)*

Supports up to 350W TDP CPUs (Liquid Cooled)​

*Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.

System Memory (per Node)

Memory

Slot Count: 16 DIMM slots

Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM

View Memory Options

On-Board Devices (per Node)

SAS

SAS (12Gbps) via Broadcom® 3808; (IT mode)

Chipset

Intel® C741

Network Connectivity

Via AIOM

View AIOM Options

View AOC Options

Input / Output (per Node)

LAN

1 RJ45 1 GbE Dedicated BMC LAN port(s)

USB

2 USB 3.0 Gen2 Type-A port(s) (Rear)

Video

1 VGA port(s)

System BIOS

BIOS Type

AMI 32MB Flash ROM

Management

Software

SuperCloud Composer

Supermicro Server Manager (SSM)

Supermicro Update Manager (SUM)

Supermicro SuperDoctor® 5 (SD5)

Super Diagnostics Offline (SDO)

Supermicro Thin-Agent Service (TAS)

SuperServer Automation Assistant (SAA) New!

Power configurations

ACPI/APM Power Management

Security

Hardware

Trusted Platform Module (TPM) 2.0

Silicon Root of Trust (RoT) – NIST 800-193 Compliant

Features

Cryptographically Signed Firmware

Secure Boot

Secure Firmware Updates

Automatic Firmware Recovery

Supply Chain Security: Remote Attestation

Runtime BMC Protections

System Lockdown

PC Health Monitoring

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

CPU

Monitors for CPU Cores, Chipset Voltages, Memory.

8+4 Phase-switching voltage regulator

Chassis

Form Factor

2U Rackmount

Model

CSE-217BQ2-R3K04P

Dimensions and Weight

Height

3.47″ (88 mm)

Width

17.68″ (449 mm)

Depth

28.75″ (730 mm)

Package

9.76″ (H) x 24.65″ (W) x 45.28″ (D)

Weight

Gross Weight: 96.6 lbs (43.8 kg)

Net Weight: 66.1 lbs (30 kg)

Available Color

Black front & silver body

Front Panel

LED

HDD activity LED

Network activity LEDs

Power status LED

Universal Information (UID) LED

Buttons

Power On/Off button

UID button

Expansion Slots (per Node)

PCI-Express (PCIe) Configuration

Default

2 PCIe 5.0 x16 LP slot(s)

View AOC Options

Drive Bays / Storage (per Node)

Drive Bays Configuration

Default: Total 6 bay(s)

2 front hot-swap 2.5″ PCIe 5.0 NVMe/SAS drive bay(s)

4 front hot-swap 2.5″ PCIe 4.0 NVMe/SAS drive bay(s)

View Drive Options

M.2

2 M.2 PCIe 4.0 x4 NVMe slot(s) (M-key 22110(default); VROC required for RAID)

View M.2 Options

System Cooling

Fans

4x 16K RPM Counter Rotating 8cm Fan(s)

Liquid Cooling

Direct to Chip (D2C) Cold Plate (optional)

Power Supply

2x 3000W Redundant (1 + 1) Titanium Level (96%) power supplies

Dimension (WxHxL)

45 x 40 x 480 mm

AC Input

1400W: 100-127Vac / 50-60Hz

2880W: 200-207Vac / 50-60Hz

3000W: 208-240Vac / 50-60Hz

3000W: 240-240Vdc / 50-60Hz (for CQC only)

+12V

Max: 116A / Min: 0A (100Vac-127Vac)

Max: 240A / Min: 0A (200Vac-207Vac)

Max: 250A / Min: 0A (208Vac-240Vac)

Max: 250A / Min: 0A (240Vdc-240Vdc) (for CQC safety rating only)

12V SB

Max: 4.5A / Min: 0A

Output Type

Backplanes (connector)

Operating Environment

ROHS

RoHS Compliant

Environmental Spec.

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)

Operating Relative Humidity: 8% to 80% (non-condensing)

Non-operating Relative Humidity: 8% to 90% (non-condensing)

Environmental / Recycling

Recycle

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