Key Applications Container-as-a-Service; Application Accelerator Diskless HPC Clusters All-Flash Hyperconverged Infrastructure Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling Single CPU configurations supported while maintaining all expansion slot functionality Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC Flexible networking with OCP 3.0 AIOM slot Up to 2 PCIe 5.0 x16 LP slots Internal PCIe 5.0 for 2x NVMe M.2 support onboard Optional 4x NVMe M.2 support onboard with built-in HW RAID1 feature via SCC-A2NM2241GH-B1 Up to 6 front hot-swap 2.5" NVMe/SAS drive bays Built-in SAS3 Support via Broadcom 3808; IT Mode

Key Applications

Container-as-a-Service; Application Accelerator

Diskless HPC Clusters

All-Flash Hyperconverged Infrastructure

Key Features

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Dual Socket E2 Intel® Xeon® 6 6700 series processors with E-cores up to 205W with air cooling or 330W with liquid cooling

Single CPU configurations supported while maintaining all expansion slot functionality

Up to 16 DIMMs supporting up to 4TB DDR5-6400 in 1DPC

Flexible networking with OCP 3.0 AIOM slot

Up to 2 PCIe 5.0 x16 LP slots

Internal PCIe 5.0 for 2x NVMe M.2 support onboard

Optional 4x NVMe M.2 support onboard with built-in HW RAID1 feature via SCC-A2NM2241GH-B1

Up to 6 front hot-swap 2.5″ NVMe/SAS drive bays

Built-in SAS3 Support via Broadcom 3808; IT Mode

Product SKUs

SuperServer SYS-222BT-HNC8R

Motherboard

Super X14DBT-B

Processor (per Node)

CPU

Dual Socket E2 (LGA-4710)

Intel® Xeon® 6 6700 series processors with E-cores

Core Count

Up to 144C/144T; Up to 108MB Cache per CPU

Note

Supports up to 205W TDP CPUs (Air Cooled)*

Supports up to 330W TDP CPUs (Liquid Cooled)​

*Air Cooled CPUs with TDP over 205W only supported under specific conditions. Contact a Supermicro representative for details.

System Memory (per Node)

Memory

Slot Count: 16 DIMM slots

Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM

View Memory Options

On-Board Devices (per Node)

SAS

SAS (12Gbps) via Broadcom® 3808; (IT mode)

Chipset

System on Chip

Network Connectivity

Via AIOM

View AIOM Options

View AOC Options

Input / Output (per Node)

LAN

1 RJ45 1 GbE Dedicated BMC LAN port(s)

USB

2 USB 3.0 Gen2 Type-A port(s) (Rear)

Video

1 VGA port(s)

System BIOS

BIOS Type

AMI 32MB Flash ROM

Management

Software

SuperCloud Composer

Supermicro Server Manager (SSM)

Super Diagnostics Offline (SDO)

Supermicro Thin-Agent Service (TAS)

SuperServer Automation Assistant (SAA) New!

Power configurations

ACPI/APM Power Management

Security

Hardware

Trusted Platform Module (TPM) 2.0

Silicon Root of Trust (RoT) – NIST 800-193 Compliant

Features

Cryptographically Signed Firmware

Secure Boot

Secure Firmware Updates

Automatic Firmware Recovery

Supply Chain Security: Remote Attestation

Runtime BMC Protections

System Lockdown

PC Health Monitoring

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

CPU

Monitors for CPU Cores, Chipset Voltages, Memory.

8+4 Phase-switching voltage regulator

Chassis

Form Factor

2U Rackmount

Model

CSE-217BQ2-R3K60P

Dimensions and Weight

Height

3.47″ (88 mm)

Width

17.68″ (449 mm)

Depth

28.75″ (730 mm)

Package

9.76″ (H) x 24.65″ (W) x 45.28″ (D)

Weight

Gross Weight: 96.6 lbs (43.8 kg)

Net Weight: 66.1 lbs (30 kg)

Available Color

Black front & silver body

Front Panel

LED

HDD activity LED

Network activity LEDs

Power status LED

Universal Information (UID) LED

Buttons

Power On/Off button

UID button

Expansion Slots (per Node)

PCI-Express (PCIe) Configuration

Default

2 PCIe 5.0 x16 LP slot(s)

1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)

View AOC Options

Drive Bays / Storage (per Node)

Drive Bays Configuration

Default: Total 6 bay(s)

2 front hot-swap 2.5″ PCIe 5.0 NVMe/SAS drive bay(s)

4 front hot-swap 2.5″ PCIe 4.0 NVMe/SAS drive bay(s)

View Drive Options

M.2

2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default); VROC required for RAID)

System Cooling

Fans

4x 16K RPM Counter Rotating 80x80x56mm Fan(s)

Liquid Cooling

Direct to Chip (D2C) Cold Plate (optional)

Power Supply

2x 3600W Redundant (1 + 1) Titanium Level (96%) power supplies

Dimension (WxHxL)

45 x 40 x 480 mm

AC Input

3600W: 0240Vdc / 50-60Hz (for CQC only)

1400W: 100-127Vac / 50-60Hz

3000W: 200-207.9Vac / 50-60Hz

3100W: 208-219.9Vac / 50-60Hz

3250W: 220-229.9Vac / 50-60Hz

3450W: 230-237.9Vac / 50-60Hz

3600W: 238-240Vac / 50-60Hz

+12V

Max: 112A / Min: 0A (100Vac-127Vac)

Max: 240A / Min: 0A (200Vac-207.9Vac)

Max: 248A / Min: 0A (208Vac-219.9Vac)

Max: 260A / Min: 0A (220Vac-229.9Vac)

Max: 276A / Min: 0A (230Vac-237.9Vac)

Max: 288A / Min: 0A (238Vac-240Vac)

12V SB

Max: 4.5A / Min: 0A

Output Type

Backplanes (gold finger)

Operating Environment

ROHS

RoHS Compliant

Environmental Spec.

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)

Operating Relative Humidity: 8% to 80% (non-condensing)

Non-operating Relative Humidity: 8% to 90% (non-condensing)