Key Applications High Performance Computing Hyperscale Cloud Applications Data Analytics Key Features Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details. Two nodes in a 1U form factor. Each node supports the following: High density 1U 2-node system with NVIDIA Grace™ CPU Superchip per node NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and CPU at 900GB/s Up to 480GB LPDDR5X onboard memory 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7 Up to 4x Hot-swap E1.S drives and 2x M.2 NVMe drives per node 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details.

Key Applications

High Performance Computing

Hyperscale Cloud Applications

Data Analytics

Key Features

Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details.

Two nodes in a 1U form factor. Each node supports the following:

High density 1U 2-node system with NVIDIA Grace™ CPU Superchip per node

NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and CPU at 900GB/s

Up to 480GB LPDDR5X onboard memory

2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7

Up to 4x Hot-swap E1.S drives and 2x M.2 NVMe drives per node

7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control

Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details.

Product SKUs

ARS-121L-DNR

Motherboard

Super G1SMH

Processor (per Node)

CPU

Single processor(s)

NVIDIA Dual 72-core CPUs on a Grace™ CPU Superchip

Note

Supports up to 500W TDP CPUs (Air Cooled)

GPU (per Node)

Max GPU Count

Up to 1 double-width or 1 single-width GPU(s)

GPU-GPU Interconnect

PCIe

System Memory (per Node)

Memory

Slot Count: Onboard Memory

Max Memory: Up to 480GB ECC

On-Board Devices (per Node)

Chipset

NVIDIA C2

Network Connectivity

View AOC Options

Input / Output (per Node)

LAN

1 RJ45 1 GbE Dedicated IPMI LAN port(s)

USB

2 port(s) (rear)

Video

1 mini-DP port(s)

System BIOS

BIOS Type

AMI 32MB SPI Flash EEPROM

Management

Power configurations

Power-on mode for AC power recovery

ACPI Power Management

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

1U Rackmount

Model

CSE-GP102TS-R000NDFP

Dimensions and Weight

Height

1.75″ (44 mm)

Width

17.33″ (440 mm)

Depth

37″ (940 mm)

Package

9.5″ (H) x 48″ (W) x 28″ (D)

Weight

Gross Weight: 65.5 lbs (29.7 kg)

Net Weight: 48.5 lbs (22 kg)

Available Color

Silver

Expansion Slots (per Node)

PCI-Express (PCIe) Configuration

Default

2 PCIe 5.0 x16 FHFL slot(s)

View AOC Options

Drive Bays / Storage (per Node)

Drive Bays Configuration

Default: Total 4 bay(s)

4 front hot-swap E1.S NVMe drive bay(s)

M.2

2 M.2 NVMe slot(s) (M-key)

View M.2 Options

System Cooling

Fans

9 Removable heavy-duty 4cm Fan(s)

Power Supply

2x 2700W Redundant Titanium Level (96%) power supplies

Dimension (WxHxL)

73.5 x 40 x 185 mm

AC Input

2700W: 200-240Vac / 50-60Hz

2700W: 240-240Vdc / 50-60Hz (for CQC only)

+12V

Max: 225A / Min: 0A (200Vac-240Vac)

Max: 225A / Min: 0A (240Vdc-240Vdc)

12V SB

Max: 4A / Min: 0A

Output Type

Backplanes (gold finger)

Operating Environment

Environmental Spec.

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)

Operating Relative Humidity: 8% to 90% (non-condensing)

Non-operating Relative Humidity: 5% to 95% (non-condensing)