Key Applications / Features - HPC - Data Center - Enterprise Server - Finanical Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 1 PCI-E 3.0 x16 (LP) slot 4. Dedicated IPMI 2.0 LAN 5. 3 Hot-swap 3.5" SATA3 drive bays 6. 2 SATA DOM + 1 SATA/NVMe M.2 (22110/2280) 7. Up to 1600W Redundant Power Supplies Titanium Level (96%)

Key Applications / Features

– HPC

– Data Center

– Enterprise Server

– Finanical Analysis

– Mission-critical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual Socket P (LGA 3647) support

2nd Gen Intel® Xeon® Scalable

processors (Cascade Lake/Skylake)‡

2. 8 DIMMs; up to 2TB 3DS ECC

DDR4-2933MHz† RDIMM/LRDIMM

3. 1 PCI-E 3.0 x16 (LP) slot

4. Dedicated IPMI 2.0 LAN

5. 3 Hot-swap 3.5″ SATA3 drive bays

6. 2 SATA DOM + 1 SATA/NVMe

M.2 (22110/2280)

7. Up to 1600W Redundant Power Supplies

Titanium Level (96%)

Product SKUs

SYS-6029TR-HTR

SuperServer 6029TR-HTR (Black)

Motherboard (Four per System)

Super X11DPT-L

Processor (per Node)

CPU

Dual Socket P (LGA 3647)

2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,

Dual UPI up to 10.4GT/s

Support CPU TDP 70-140W

Cores

Up to 22 Cores

Note

*Processors ending N or S (such as 6230N, 5220S) are not supported

Note

‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)

System Memory (per Node)

Memory Capacity

8 DIMM slots

Up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM

Memory Type

2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM

Note

† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro

On-Board Devices (per Node)

Chipset

Intel® C621 chipset

SATA

SATA3 (6Gbps); RAID 0, 1, 5 support

Network Controllers

Intel® C621 chipset

IPMI

Support for Intelligent Platform Management Interface v.2.0

IPMI 2.0 with virtual media over LAN and KVM-over-LAN support

Graphics

ASPEED AST2500 BMC

Input / Output (per Node)

SATA

3 SATA3 (6Gbps) ports

LAN

2 RJ45 Gigabit Ethernet LAN ports

1 RJ45 Dedicated IPMI LAN port

USB

2 USB 3.0 ports total (rear)

VGA

1 VGA port

Serial Port / Header

1 COM Port (1 rear)

Others

TPM 2.0 Header

System BIOS

BIOS Type

AMI 32Mb SPI Flash ROM with UEFI

Management

Software

Intel® Node Manager

IPMI 2.0

KVM with dedicated LAN

NMI

SSM, SPM, SUM

SuperDoctor® 5

Watchdog

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory.

4+1 Phase-switching voltage regulator

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

2U Rackmount

Model

CSE-827HQ-R1K68BP3

Dimensions and Weight

Width

17.25″ (438mm)

Height

3.47″ (88mm)

Depth

28.5″ (724mm)

Weight

Gross Weight: 73.5 lbs (33.34kg)

Net Weight: 52.1 lbs (23.63kg)

Available Colors

Black

Front Panel

Buttons

Power On/Off button

UID button

LEDs

Power status LED

HDD activity LED

Network activity LEDs

Universal Information (UID) LED

Expansion Slots (per Node)

PCI-Express

1 PCI-E 3.0 x16 Low-profile slot

Drive Bays / Storage (per Node)

Hot-swap

3 Hot-swap 3.5″ SATA3 HDD trays

Others

2 SATA DOM

1 PCI-E 3.0 x4 NVMe or 1 SATA M.2 (22110/2280) support via BPN-ADP-6SATA3M2-1UL* M.2 and SuperDOM are for OS boot

System Cooling

Fans

4x 8cm heavy duty PWM fans with optimal fan speed controlled

Power Supply (76mm Width)

1600W 1U Redundant Power Supplies with PMBus

Total Output Power

800W: 100 – 140Vac

1600W: 180 – 240Vac

Dimension

(W x H x L)

76 x 40.4 x 336 mm

Input

100-140Vac / 10-7A / 50-60Hz

180-240Vac / 11-8A / 50-60Hz

+12V

Max: 67A / Min: 0A (100-140Vac)

Max: 133A / Min: 0A (180-240Vac)

+5Vsb

Max: 1A / Min: 0A

Output Type

27 Pairs Gold Finger Connector

Certification

Titanium Level

[ Test Report ]

Operating Environment

RoHS

RoHS Compliant

Environmental Spec.

Operating Temperature:

10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature:

-40°C to 60°C (-40°F to 140°F)

Operating Relative Humidity:

8% to 90% (non-condensing)

Non-operating Relative Humidity:

5% to 95% (non-condensing)