Key Applications Virtualization Networking Appliance Cloud Computing Data Center Optimized Database/Storage Storage Headnode Entry GPU server Web Cache, CDN, Video Streaming AI Inference Key Features WIO systems offer flexible I/O configurations in a cost-effective architecture to deliver truly optimized systems for specific enterprise requirements. Single Intel® Xeon® 6 6700 series processor with E-cores 8 DIMM slots supporting up to 1TB of memory (6700E series CPU). Tool-less, Top-loading riser design support 3 PCIe 5.0 Expansion (2x FHFL + 1x LP). Native SATA drives supported, with option for up to 8 PCIe 5.0 NVMe drives or 10 SAS drives. Trusted Platform Module (TPM) 2.0 onboard.

Key Applications

Virtualization

Networking Appliance

Cloud Computing

Data Center Optimized

Database/Storage

Storage Headnode

Entry GPU server

Web Cache, CDN, Video Streaming

AI Inference

Key Features

WIO systems offer flexible I/O configurations in a cost-effective architecture to deliver truly optimized systems for specific enterprise requirements.

Single Intel® Xeon® 6 6700 series processor with E-cores

8 DIMM slots supporting up to 1TB of memory (6700E series CPU).

Tool-less, Top-loading riser design support 3 PCIe 5.0 Expansion (2x FHFL + 1x LP).

Native SATA drives supported, with option for up to 8 PCIe 5.0 NVMe drives or 10 SAS drives.

Trusted Platform Module (TPM) 2.0 onboard.

Product SKUs

SuperServer SYS-112B-WR

Motherboard

Super X14SBW-F

Processor

CPU

Single Socket E2 (LGA-4710)

Intel® Xeon® 6 6700 series processors with E-cores

Core Count

Up to 144C/144T; Up to 108MB Cache

Note

Supports up to 300W TDP CPUs (Air Cooled)

GPU

Max GPU Count

Up to 2 single-width GPU(s)

CPU-GPU Interconnect

PCIe 5.0 x16 CPU-to-GPU Interconnect

System Memory

Memory

Slot Count: 8 DIMM slots/8 Channels

Max Memory (1DPC): Up to 1TB 6400MT/s ECC DDR5 RDIMM

View Memory Options

On-Board Devices

SATA

SATA (6Gbps)

NVMe

NVMe; RAID 0/1/5/10 support(Intel® VROC RAID key required)

View NVMe Options

Chipset

System on Chip

Network Connectivity

2 RJ45 1GbE with Intel® I210

View AOC Options

Input / Output

LAN

2 RJ45 1 GbE LAN port(s)

1 RJ45 1 GbE Dedicated BMC LAN port(s) (IPMI shared on LAN port 1)

USB

2 USB 3.2 Gen1 Type-A port(s) (rear)

2 USB 3.2 Gen1 Type-A port(s) (front)

Video

1 VGA port(s)

Serial

1 COM port(s) (Rear)

1 COM port(s) (Header)

TPM

1 TPM header

System BIOS

BIOS Type

AMI 64MB SPI Flash EEPROM

Management

Software

SuperCloud Composer

Supermicro Server Manager (SSM)

Super Diagnostics Offline (SDO)

Supermicro Thin-Agent Service (TAS)

SuperServer Automation Assistant (SAA) New!

Power configurations

ACPI/APM Power Management

Security

Hardware

Trusted Platform Module (TPM) 2.0

Silicon Root of Trust (RoT) – NIST 800-193 Compliant

Features

Cryptographically Signed Firmware

Secure Boot

Secure Firmware Updates

Automatic Firmware Recovery

Supply Chain Security: Remote Attestation

Runtime BMC Protections

System Lockdown

PC Health Monitoring

CPU

Monitors for CPU Cores, Chipset Voltages, Memory

8 Phase-switching voltage regulator

FAN

Fans with tachometer monitoring

Status monitor for speed control

Pulse Width Modulated (PWM) fan connectors

Temperature

Monitoring for CPU and chassis environment

Thermal Control for fan connectors

Chassis

Form Factor

1U

Model

CSE-116BTS-R000WNP

Dimensions and Weight

Height

1.7″ (43 mm)

Width

17.2″ (437 mm)

Depth

23.5″ (597 mm)

Package

7.75″ (H) x 23.5″ (W) x 31.5″ (D)

Weight

Gross Weight: 33.5 lbs (15.2 kg)

Net Weight: 21 lbs (9.53 kg)

Available Color

Black

Front Panel

LED

Fan Fail/System Over Heat LED

HDD activity LED

Network Activity LEDs

Power status LED

Buttons

Power On/Off button

Unit Identification (UID) button

Expansion Slots

PCI-Express (PCIe) Configuration

Default

2 PCIe 5.0 x16 FHFL slot(s)

1 PCIe 5.0 x8 (in x16) LP slot(s)

View AOC Options

Drive Bays / Storage

Drive Bays Configuration

Default: Total 8 bay(s)

8 front hot-swap 2.5″ SATA drive bay(s)

Option A: Total 10 bay(s)

8 front hot-swap 2.5″ SATA drive bay(s)

2 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bay(s)

Option B: Total 10 bay(s)

4 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bay(s)

6 front hot-swap 2.5″ SATA drive bay(s)

Option C: Total 10 bay(s)

8 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bay(s)

2 front hot-swap 2.5″ SATA drive bay(s)

Option D: Total 10 bay(s)

10 front hot-swap 2.5″ SAS* drive bay(s)

(*NVMe/SAS support may require additional storage controller and/or cables, please see the optional parts list for details)

View NVMe Options

View Drive Options

M.2

2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key 2280/22110; VROC required for RAID)

View M.2 Options

System Cooling

Fans

1 AOC cooling Fan(s) (optional)

5 middle cooling PWM 40x40x56mm Fan(s)

Air Shroud

1 CPU Air Shroud(s)

Power Supply

2x 860W Redundant (1 + 1) Titanium Level (96%) power supplies

Dimension (WxHxL)

54.5 x 40.25 x 322 mm

AC Input

800W: 100-127Vac / 50-60Hz

860W: 200-240Vac / 50-60Hz

860W: 240Vdc / 50-60Hz

+12V

Max: 66.67A / Min: 0A (100Vac-127Vac)

Max: 71.67A / Min: 0A (200Vac-240Vac)

Max: 71.67A / Min: 0A (Vdc-240Vdc)

5V SB

Max: 4A / Min: 0A

Output Type

Backplanes (gold finger)

Operating Environment

Environmental Spec.

Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)

Non-operating Temperature: -30°C to 60°C (-22°F to 140°F)

Operating Relative Humidity: 8% to 80% (non-condensing)

Non-operating Relative Humidity: 8% to 90% (non-condensing)